# K4B2G0846F-BYK0 Alternative — HGD32L08S16 Drop-in Replacement | HGCHIPS

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# K4B2G0846F-BYK0 alternative — HGD32L08S16 drop-in replacement

**HGD32L08S16** is a pin-to-pin compatible replacement for **Samsung K4B2G0846F-BYK0**. It matches the original on density (2 Gbit), organization (256Mx8), speed grade (DDR3-1600), voltage (1.35 V) and package (VFBGA-96), so no PCB or firmware change is required. Samples start at 10 pcs with lot-level test reports.

Specification comparison

## K4B2G0846F-BYK0 vs HGD32L08S16 — what has to match

Every field below is compared line by line against the original manufacturer's public datasheet before a part is offered as a replacement.

| Parameter | Samsung K4B2G0846F-BYK0 (original) | HGD32L08S16 (HGCHIPS) | Match |
| --- | --- | --- | --- |
| Density (Gbit) | 2 | 2 | ✔ Same |
| Organization | 256Mx8 | 256Mx8 | ✔ Same |
| Speed Grade | DDR3-1600 | DDR3-1600 | ✔ Same |
| Voltage (V) | 1.35 | 1.35 | ✔ Same |
| Package | VFBGA-96 | VFBGA-96 | ✔ Same |
| Temperature Grade | Commercial (0~+95C) | Commercial (0~+95C) | ✔ Same |

Compatibility is based on electrical and mechanical comparison against the original manufacturer's public datasheet. Always qualify on your platform before volume use; test reports and application support are provided.

Why switch

## Reasons teams open a second source on K4B2G0846F-BYK0

📦

### Supply certainty

When the original is on allocation or past end-of-life, HG parts ship from physical stock — stock lines in 48 hours from Shenzhen.

🧪

### Tested, not claimed

Every lot ships with traceable validation records for your incoming QA.

🔧

### Engineering support

Datasheet-level comparison and application support from our Taiwan and Shenzhen engineering team.

FAQ

## K4B2G0846F-BYK0 alternative — common questions

### Is HGD32L08S16 a direct replacement for Samsung K4B2G0846F-BYK0?

Yes. HGD32L08S16 is engineered as a pin-to-pin compatible replacement for Samsung K4B2G0846F-BYK0: DDR3 2 Gbit 256Mx8 in a VFBGA-96 package. Ball map, electrical specification and timing are compared against the original manufacturer's public datasheet, and the part is functionally validated before shipment.

### Do I need to change my PCB or firmware for HGD32L08S16?

No PCB or firmware change is intended. The part is designed for the same footprint and ball map as Samsung K4B2G0846F-BYK0. Always qualify the replacement on your own board before volume use — we provide samples from 10 pcs and lot-level test reports for that purpose.

### What is the minimum order quantity?

Samples start at 10 pcs. Sample cost is credited against your first production order.

### What lead time should I expect?

Stock lines ship within 48 hours from Shenzhen. Non-stock and long-lifecycle programs are quoted with a confirmed lead time — send your target quantity and we reply within 24 business hours.

### How is compatibility verified?

Our Taiwan engineering team compares density, organization, speed grade, voltage, package and temperature grade against the original datasheet, then the part is functionally validated on mainstream platforms, with traceable per-lot records.

## Request HGD32L08S16 samples or a quote

Send your target quantity and platform — we confirm compatibility, share test reports and quote within 24 business hours.

Request a Quote
Full HGD32L08S16 specification →

Also comparing

## Other alternatives in this series

[K4B2G0846F-BYMA alternative](https://hgchips.net/alternatives/k4b2g0846f-byma.html) [K4B2G1646F-BYK0 alternative](https://hgchips.net/alternatives/k4b2g1646f-byk0.html) [K4B2G1646F-BYMA alternative](https://hgchips.net/alternatives/k4b2g1646f-byma.html)

See the full [part number index](https://hgchips.net/alternatives/../parts.html), the [K4B series page](https://hgchips.net/alternatives/../series/k4b.html), or [search by original part number](https://hgchips.net/alternatives/../cross-reference.html).

### HGCHIPS

A Zhongshan (China) based semiconductor supply partner for import substitution — pin-to-pin replacement for Samsung, SK Hynix, Micron, Nanya memory and ADI μModule power parts that are on allocation, NRND or EOL, with engineering support from Taiwan.

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### Contact

✉ sales@hgchips.net
☎ +86 760 8992 4799 (Zhongshan HQ)
💬 WhatsApp — management +852 9298 5589
💬 WhatsApp — sales +852 9298 5590
📍 Room 301-319, 3/F, Longde Building, Wuguishan Street, Zhongshan 528400, Guangdong, China

© 2026 Zhongshan Huagong Technology Co., Ltd. (HGCHIPS). All third-party brand names and part numbers (Samsung, SK Hynix, Micron, Nanya, ADI, etc.) are the property of their respective owners and are used solely to describe compatibility. HGCHIPS parts are independently engineered replacements and are not manufactured or endorsed by the original brands. Stock levels, lead times and pricing shown on this site are indicative and confirmed at quotation.

Last updated: 2026-09-27 · [Sitemap](https://hgchips.net/sitemap.xml)

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Source: https://hgchips.net/alternatives/k4b2g0846f-byk0.html  
Last updated: 2026-09-28
