# DDR3 DDR4 LPDDR4X In Stock — PIN2PIN 免改板 Memory | HGCHIPS

📍 Zhongshan HQ · Memory & Power Import Substitution · Taiwan Engineering · US Sales Support
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# Product lines — drop-in memory & power, tested before they ship



245 HGCHIPS memory part pages are engineered as drop-in alternatives for mainstream Samsung, SK Hynix, Micron and Nanya DDR3 / DDR4 / LPDDR4 / LPDDR4X devices. Plus 30 HG-series replacements for ADI LTM46xx/LTM80xx μModule DC-DC regulators — and original-brand memory spot stock for urgent lines.









Memory ICs


## Compatible DRAM — same PCB, same firmware, no redesign



Electrical parameters, ball maps and timings are compared against original datasheets by our Taiwan engineering team. Every part 100% tested in our Shenzhen test center before shipment.




DDR3 SDRAM



### 57 parts · 1–8 Gbit



1333–2133 MT/s · x8/x16 · 1.35/1.5 V · VFBGA-96 · commercial & industrial (-40~+95°C). The long-lifecycle memory original vendors are leaving behind.


DDR3 details →





DDR4 SDRAM



### 30 parts · 4–32 Gbit



2666–3200 MT/s · x8/x16 · 1.2 V · FBGA-78/96 · includes SK Hynix D-die equivalents and 32 Gbit high-density options.


DDR4 details →





LPDDR4 / LPDDR4X



### 39 parts · 4–128 Gbit



x16/x32/x64 · 1600–4266 MT/s · VFBGA-200 · for edge AI, automotive and power-constrained designs.


LPDDR4 details →







Power modules


## ADI μModule compatible — HG46xx / HG80xx



30 pin-compatible HG-series replacements for ADI (Linear Technology) LTM46xx and LTM80xx point-of-load DC-DC μModule regulators — long-term stock, away from allocation and premium broker pricing.




HG46xx Series



### Replaces LTM46xx — 22 models



LTM4600→LTM4700 family, POL regulators from low-power 4 A-class to high-current multi-output modules. LGA/BGA footprint compatible.


HG46xx details →





HG80xx Series



### Replaces LTM80xx — 8 models



LTM8023→LTM8056 wide-input step-down regulators for industrial and communications systems.


HG80xx details →







Original-brand spot stock


## Need the exact brand part? We source it.



For BOMs that must stay on the original brand — Samsung, SK Hynix, Micron, Nanya, ESMT — our channel provides genuine, tested spot stock across Zhongshan, Shenzhen and Hong Kong.



[Original Memory Stock →](https://hgchips.net/product-original-stock.html) [Search all 275 part pages](https://hgchips.net/cross-reference.html)








## Product families at a glance — DDR3, DDR4, LPDDR4X and ADI µModule



The table below summarises the five families we cross-reference and the number of HGCHIPS part numbers available in each. Counts and parameter ranges are taken from our own part master, the same source used to build the [cross-reference table](https://hgchips.net/cross-reference.html) and the [full part list](https://hgchips.net/parts.html).




| Family | Mapped part numbers | Density (Gbit) | Organization | Speed grades | Voltage (V) | Package | Temperature grade |
| --- | --- | --- | --- | --- | --- | --- | --- |
| DDR3 | 57 | 1 / 2 / 4 / 8 | 128Mx16 / 128Mx8 / 1Gx4 / 1Gx8 / 256Mx16 / 256Mx8 / 512Mx16 / 512Mx8 / 64Mx16 | DDR3-1066 – DDR3-2133 | 1.35 / 1.5 | VFBGA-96 | Commercial 0 to +95 °C / Industrial −40 to +95 °C |
| DDR4 | 30 | 4 / 8 / 16 / 32 | 1Gx16 / 1Gx8 / 256Mx16 / 2Gx16 / 2Gx8 / 4Gx8 / 512Mx16 | DDR4-2666 – DDR4-3200 | 1.2 | FBGA-78/96 | Commercial 0 to +95 °C / Industrial −40 to +95 °C |
| LPDDR4 / LPDDR4X | 39 | 4 / 8 / 16 / 24 / 32 / 64 / 128 | x16 / x32 / x64 | LPDDR4-1600 – LPDDR4X-4266 | 1.8/1.1/0.6 / 1.8/1.1/1.1 / 1.8/1.2/1.2 | VFBGA-200 | Commercial 0 to +95 °C |
| ADI LTM46xx µModule | 21 | — | — | — | — | — | — |
| ADI LTM80xx µModule | 8 | — | — | — | — | — | — |





How to read this table: density, organization, speed, voltage and package are listed as
offered across the family — a specific original part number maps to one specific HGCHIPS part, not to the
whole row. Send the original part number (for example K4B1G0846I-BCK0) and we reply with the
matching HGCHIPS part plus a field-by-field comparison.
ADI LTM modules are quoted per original part number; the 29
LTM46xx / LTM80xx part numbers above are mapped to HG equivalents named HG46xx / HG80xx.
Original ADI stock (for example LTM3605) is supplied as the original part, not as a replacement.





## Frequently asked questions about our product families

### Which memory families do you supply?

DDR3, DDR4, LPDDR4 and LPDDR4X memory devices, plus LTM46xx / LTM80xx µModule power modules, as pin-to-pin compatible replacements for imported part numbers. See the [family table above](#families) for densities, speed grades, voltages and packages.

### Is a replacement really pin-to-pin compatible?

The replacement uses the same package and the same ball or pad map, so the existing PCB is not changed. We confirm the comparison spec by spec (density, organization, speed, voltage, package, temperature grade) before quoting.

### What is the minimum order and the lead time?

Samples start from 10 pcs, quotes are answered within 24 hours, and in-stock items dispatch from Shenzhen within 48 hours.






### HGCHIPS



A Zhongshan (China) based semiconductor supply partner for import substitution — PIN2PIN replacement for Samsung, SK Hynix, Micron, Nanya memory and ADI µModule power parts that are on allocation, NRND or EOL, with engineering support from Taiwan.






### Products


DDR3 SDRAM
DDR4 SDRAM
LPDDR4 / LPDDR4X
ADI μModule Compatible
Original Memory Stock
Hot Stock — DDR3 / DDR4 Lines
Hot Stock — ADI µModule Lines
Hot Stock — Smart-Glasses BOM
Cross Reference




### Company


About Us
Quality & Testing
Resources
Datasheets
Contact




### Contact


✉ sales@hgchips.net
☎ +86 760 8992 4799 (Zhongshan HQ)
📱 +852 9298 5589 (24h mobile)
💬 WhatsApp — management +852 9298 5589 💬 WhatsApp — sales +852 9298 5590
📍 Room 301-319, 3/F, Longde Building, Wuguishan Street, Zhongshan 528400, Guangdong, China
🧭 Memory & Power Import Substitution
🇺🇸 US Sales Support




© 2026 Zhongshan Huagong Technology Co., Ltd. (HGCHIPS). All third-party brand names and part numbers (Samsung, SK Hynix, Micron, Nanya, ADI, etc.) are the property of their respective owners and are used solely to describe compatibility. HGCHIPS parts are independently engineered replacements and are not manufactured or endorsed by the original brands. Stock levels, lead times and pricing shown on this site are indicative and confirmed at quotation.




Last updated: 2026-09-21 · [Sitemap](https://hgchips.net/sitemap.xml)

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Source: https://hgchips.net/products.html  
Last updated: 2026-09-26
