HGCHIPS (Zhongshan Huagong Technology Co., Ltd.) offers verified surplus inventory released from a long-running, high-volume smart-glasses production program. Original manufacturer part numbers. Immediate shipment from our Shenzhen warehouse, 48h dispatch.
| Manufacturer | Part Number | Description | Qty |
|---|---|---|---|
| Qualcomm | WCN-3980-0-82BWLPSP-MT-0B-0 | Wireless connectivity combo (Wi-Fi/BT) | 590 |
| Qualcomm | SW-5100P-1-PPSP572-**-00-*-AA | App processor, ARM Cortex-A53 quad 1.7GHz | 104 |
| Qualcomm | PMW-5100-2-FOWPSP228B-MT-02-0 | PMIC | 603 |
| Bestechnic | BES2700BP-Z66 | Ultra-low-power Bluetooth wearable platform | 1,037 |
| Kingston | 32CP16-M4FTC32 | eMMC 5.1 32GB + LPDDR4X 2GB POP, FBGA-144 | 2,283 |
| Maxim | MAX86174AENE | Optical health sensor | 105 |
| mCube | MC3632 | 3-axis accelerometer | 5,085 |
| Richtek | RT6160AWSC | Buck-Boost 3A, WLCSP-15 | 9,564 |
| TI | TPS62A01DRLR | 1A synchronous buck, SOT-563 | 2,199 |
| Diodes Inc | PI3WVR626XEBEX | MIPI switch, 6GHz, X1QFN-24 | 9,071 |
| Diodes Inc | PI3CSW12ZUAEX | I3C switch 1:2, UQFN-10 | 7,070 |
| Hirose | BK13H-40DS/2-0.35V0.5 | Board-to-board, 1.0mm, 40-pin | 15,050 |
| Hirose | BK13C06-6DS/2-0.35V(800) | FPC-to-board hybrid, 6-pin 0.35mm | 14,907 |
| Bone voiceprint | SV01-008 | Bone voiceprint microphone | 7,008 |
Plus full BOM of Murata MLCCs/inductors/ferrite beads, YAGEO chip resistors (01005/0201/0402), Hirose BTB/FPC connectors, SG Micro / Awinic power & signal ICs, shielding frames and RF parts. Complete list available on request.
Email us and we will send the complete surplus BOM list (XLSX) with quantities and pricing — no obligation.
sales@hgchips.net · ☎ +86 760 8992 4799 · WhatsApp +852 9298 5590Also in stock: DDR3 / DDR4 memory lines · ADI µModule lines (LTM3605 lead part)