HGD31L16E13 is a pin-to-pin compatible replacement for ESMT M15T1G1664A. It matches the original on density (1 Gbit), organization (64Mx16), voltage (1.35 V DDR3L) and package (96-ball), so no PCB or firmware change is required. Samples start at 10 pcs with lot-level test reports.
Every field below is compared line by line against the original manufacturer's public datasheet before a part is offered as a replacement.
| Parameter | ESMT M15T1G1664A (original) | HGD31L16E13 (HGCHIPS) | Match |
|---|---|---|---|
| Density (Gbit) | 1 | 1 | ✔ Same |
| Organization | 64Mx16 | 64Mx16 | ✔ Same |
| Speed Grade | DDR3-1333 (2S/2T) | DDR3-1333 | ✔ Same |
| Voltage (V) | 1.35 | 1.35 | ✔ Same |
| Package | 96-ball VFBGA | VFBGA-96 | ✔ Same |
| Temperature Grade | Commercial (0~+95C) | Commercial (0~+95C) | ✔ Same |
Compatibility is based on electrical and mechanical comparison against the original manufacturer's public datasheet. Always qualify on your platform before volume use; test reports and application support are provided. M15T1G1664A is offered in 2S/2T temperature/speed grades; HGD31L16E13 covers the standard DDR3L-1333 grade. Industrial temperature grades are confirmed on request.
When the original is on allocation or past end-of-life, HG parts ship from physical stock — stock lines in 48 hours from Shenzhen.
Every lot ships with traceable validation records for your incoming QA.
Datasheet-level comparison and application support from our Taiwan and Shenzhen engineering team.
Yes. HGD31L16E13 is engineered as a pin-to-pin compatible replacement for ESMT M15T1G1664A. Ball map, electrical specification and timing are compared against the original manufacturer's public datasheet, and the part is functionally validated before shipment.
No PCB or firmware change is intended. The part is designed for the same footprint and ball map as ESMT M15T1G1664A. Always qualify the replacement on your own board before volume use — we provide samples from 10 pcs and lot-level test reports for that purpose.
Samples start at 10 pcs. Sample cost is credited against your first production order.
Stock lines ship within 48 hours from Shenzhen. Non-stock and long-lifecycle programs are quoted with a confirmed lead time — send your target quantity and we reply within 24 business hours.
Our Taiwan engineering team compares density, organization, speed grade, voltage, package and temperature grade against the original datasheet, then the part is functionally validated on mainstream platforms, with traceable per-lot records.
Send your target quantity and platform — we confirm compatibility, share test reports and quote within 24 business hours.
Request a Quote Full HGD31L16E13 specification →See the full part number index, the DDR3 SDRAM product line, or search by original part number.