From incoming lot to shippable part
Incoming inspection
Visual, electrical and functional checks on arrival — every lot screened before it enters our stock.
Platform verification
Real-boot and functional validation on mainstream CPU & SoC platforms, compared against the original part.
Burn-in & screening
High-temperature, cycling and stress screening. Industrial-grade options qualified for -40~+95°C.
Records with every lot
Each part is traceable; the test report ships with the goods. SGS / RoHS / REACH available per lot.
Where the claims get proven
Screening methods: automated DRAM/SoC functional test · thermal imaging under load · dye-and-walk package integrity check · visual inspection for solder defects. Sample test report available for any part number you are evaluating.
JEDEC-standard comparison
Each HG part is compared against original datasheets by our Taiwan engineering team — ball maps, electrical specs and timings, not just a part-number match.
Tier-1 packaging partners
Deep cooperation with leading Chinese packaging houses enables advanced, higher-speed package solutions for high-end programs.
Dedicated industrial line
Industrial-temperature parts (I-suffix, e.g. HGD32G16N18I) qualified for -40~+95°C environments — no guesswork on extended temperature.
Ask for our test procedure & sample reports — or join a live video test
We will share a sample test report for your target part number, walk through how we qualify against your platform, and — if you prefer — run your part live on our bench over a video call.
Request Test Report Sample → Book a Live Video Test on WhatsApp