We help global hardware teams replace EOL, allocated or premium-priced memory and power parts with PIN2PIN compatible, tested alternatives — without changing a single pad or line of firmware.
Founded in 2019 in Zhongshan, Guangdong, China, we are a semiconductor localization and supply expert serving two needs at once:
📍 Room 301-319, 3/F, Longde Building, Wuguishan Street, Zhongshan 528400, Guangdong, China
Headquarters, warehousing and global shipping coordination.
Room 301-319, 3/F, Longde Building, Wuguishan Street, Zhongshan 528400, Guangdong, China
☎ +86 760 8992 4799 · 📱 +852 9298 5589
Visual, electrical and functional testing on mainstream CPU/SoC platforms plus burn-in screening. Every lot ships with records.
Customer service and technical coordination hub for domestic and cross-border programs.
JEDEC spec comparison, datasheet-level qualification support and genuine-channel sourcing for imported stock.
Remote coverage for North American customers during local business hours. No US warehouse or US legal entity is claimed — shipments originate from Zhongshan / Hong Kong.
Export coordination for overseas customers — ☎ +852 9298 5589, WhatsApp +852 9298 5590.
Photos and short clips from our Zhongshan stockroom and Shenzhen test floor. Video calls and on-site visits are welcome — bring your part number and we will run it live on the bench.
We qualify parts at datasheet level — ball maps, timings, thermal behavior — before we ever put a part number in front of you.
DDR3 and mature-node parts are still core to us. We support industrial designs that outlive OEM allocations.
Test reports ship with every lot. SGS / RoHS / REACH documentation is available per shipment.
We can prepare a short PDF profile covering our testing flow, cross-reference coverage and supply capabilities.
Request Company Profile → Talk to an EngineerZhongshan Huagong Technology Co., Ltd. (HGCHIPS) supplies DRAM and power modules as import-substitution stock, with engineering support from Taiwan and sales support in the US.
| Product line | Densities | Voltage | Package | Speed grades |
|---|---|---|---|---|
| DDR3 SDRAM | 1 / 2 / 4 / 8 Gb | 1.35 V / 1.5 V | VFBGA-96 | DDR3-1066 / 1333 / 1600 / 1866 / 2133 |
| DDR4 SDRAM | 4 / 8 / 16 / 32 Gb | 1.2 V | FBGA-78/96 | DDR4-2666 / 2933 / 3200 |
| LPDDR4 / LPDDR4X | 4 / 8 / 16 / 24 / 32 / 64 / 128 Gb | 1.8 / 1.1 / 0.6 V | VFBGA-200 | LPDDR4-1600 to LPDDR4X-4266 |
| ADI LTM46xx / LTM80xx µModule | — | — | — | Replacement line; electrical data per part number |