📍 Zhongshan HQ · Memory & Power Import Substitution · Taiwan Engineering · US Sales Support 📧 sales@hgchips.net  |  ☎ +86 760 8992 4799  |  💬 WhatsApp: +852 9298 5589 (management) / +852 9298 5590 (sales)  |  🕑 Quote reply < 24h
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A supply partner built for engineers who can't afford a bad part

We help global hardware teams replace EOL, allocated or premium-priced memory and power parts with PIN2PIN compatible, tested alternatives — without changing a single pad or line of firmware.

Who we are

HGCHIPS is the international brand of Zhongshan Huagong Technology Co., Ltd.

Founded in 2019 in Zhongshan, Guangdong, China, we are a semiconductor localization and supply expert serving two needs at once:

  • Drop-in compatible memory — DDR3, DDR4 and LPDDR4/X engineered to replace Samsung, SK Hynix, Micron and Nanya part numbers with identical ball maps, electrical specs and timings.
  • ADI μModule-compatible power modules — HG-series modules (LTM46xx / LTM80xx families) and genuine imported stock for hard-to-find allocations.
  • Tested, not just claimed — every lot is inspected and functionally verified against the original datasheet before shipment.
HGCHIPS headquarters and warehouse building in Zhongshan, Guangdong, China
Zhongshan HQ & stockroom — Guangdong, China
Memory module electrical and functional test bench at the Shenzhen test center
Shenzhen test bench — 100% pre-shipment inspection

📍 Room 301-319, 3/F, Longde Building, Wuguishan Street, Zhongshan 528400, Guangdong, China

Global footprint

Our locations, one quality standard

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Zhongshan HQ — China

Headquarters & logistics

Headquarters, warehousing and global shipping coordination.
Room 301-319, 3/F, Longde Building, Wuguishan Street, Zhongshan 528400, Guangdong, China
☎ +86 760 8992 4799 · 📱 +852 9298 5589

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Shenzhen Test Center

100% inspection & verification

Visual, electrical and functional testing on mainstream CPU/SoC platforms plus burn-in screening. Every lot ships with records.

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Chengdu Office

Regional sales & support

Customer service and technical coordination hub for domestic and cross-border programs.

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Taiwan

Engineering support

JEDEC spec comparison, datasheet-level qualification support and genuine-channel sourcing for imported stock.

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US Sales Support

North America coverage

Remote coverage for North American customers during local business hours. No US warehouse or US legal entity is claimed — shipments originate from Zhongshan / Hong Kong.

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Hong Kong Export Desk

Overseas orders & documentation

Export coordination for overseas customers — ☎ +852 9298 5589, WhatsApp +852 9298 5590.

Inside the operation

Factory floor, stockroom and test line — see for yourself

Photos and short clips from our Zhongshan stockroom and Shenzhen test floor. Video calls and on-site visits are welcome — bring your part number and we will run it live on the bench.

HGCHIPS memory stockroom with incoming lots staged for inspection
Stockroom — incoming lots staged for 100% inspection
High temperature burn-in and cycling screening equipment
Burn-in & thermal cycling screening
DRAM tester running functional verification against the original part
DRAM tester — original vs. HG side by side
Proof points

What 500+ engineering projects taught us

500+
projects served — base stations, BMS, medical CT, AI accelerators
~80%
of customers are server & AI hardware OEM/ODMs
15–30%
typical cost reduction at equal performance
10 pcs
MOQ for engineering samples
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Engineering-first

We qualify parts at datasheet level — ball maps, timings, thermal behavior — before we ever put a part number in front of you.

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Long-lifecycle commitment

DDR3 and mature-node parts are still core to us. We support industrial designs that outlive OEM allocations.

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Transparency

Test reports ship with every lot. SGS / RoHS / REACH documentation is available per shipment.

🔒 Customer names: our OEM/ODM customers include listed companies in EV, EMS and computing. Names are shared under NDA on request — we don't publish them without permission.

Want a company profile you can forward to your sourcing team?

We can prepare a short PDF profile covering our testing flow, cross-reference coverage and supply capabilities.

Request Company Profile → Talk to an Engineer

HGCHIPS at a glance

Zhongshan Huagong Technology Co., Ltd. (HGCHIPS) supplies DRAM and power modules as import-substitution stock, with engineering support from Taiwan and sales support in the US.

Product lineDensitiesVoltagePackageSpeed grades
DDR3 SDRAM1 / 2 / 4 / 8 Gb1.35 V / 1.5 VVFBGA-96DDR3-1066 / 1333 / 1600 / 1866 / 2133
DDR4 SDRAM4 / 8 / 16 / 32 Gb1.2 VFBGA-78/96DDR4-2666 / 2933 / 3200
LPDDR4 / LPDDR4X4 / 8 / 16 / 24 / 32 / 64 / 128 Gb1.8 / 1.1 / 0.6 VVFBGA-200LPDDR4-1600 to LPDDR4X-4266
ADI LTM46xx / LTM80xx µModule———Replacement line; electrical data per part number