245 HGCHIPS memory part pages are engineered as drop-in alternatives for mainstream Samsung, SK Hynix, Micron and Nanya DDR3 / DDR4 / LPDDR4 / LPDDR4X devices. Plus 30 HG-series replacements for ADI LTM46xx/LTM80xx μModule DC-DC regulators — and original-brand memory spot stock for urgent lines.
Electrical parameters, ball maps and timings are compared against original datasheets by our Taiwan engineering team. Every part 100% tested in our Shenzhen test center before shipment.
1333–2133 MT/s · x8/x16 · 1.35/1.5 V · VFBGA-96 · commercial & industrial (-40~+95°C). The long-lifecycle memory original vendors are leaving behind.
DDR3 details →2666–3200 MT/s · x8/x16 · 1.2 V · FBGA-78/96 · includes SK Hynix D-die equivalents and 32 Gbit high-density options.
DDR4 details →x16/x32/x64 · 1600–4266 MT/s · VFBGA-200 · for edge AI, automotive and power-constrained designs.
LPDDR4 details →30 pin-compatible HG-series replacements for ADI (Linear Technology) LTM46xx and LTM80xx point-of-load DC-DC μModule regulators — long-term stock, away from allocation and premium broker pricing.
LTM4600→LTM4700 family, POL regulators from low-power 4 A-class to high-current multi-output modules. LGA/BGA footprint compatible.
HG46xx details →LTM8023→LTM8056 wide-input step-down regulators for industrial and communications systems.
HG80xx details →For BOMs that must stay on the original brand — Samsung, SK Hynix, Micron, Nanya, ESMT — our channel provides genuine, tested spot stock across Zhongshan, Shenzhen and Hong Kong.
The table below summarises the five families we cross-reference and the number of HGCHIPS part numbers available in each. Counts and parameter ranges are taken from our own part master, the same source used to build the cross-reference table and the full part list.
| Family | Mapped part numbers | Density (Gbit) | Organization | Speed grades | Voltage (V) | Package | Temperature grade |
|---|---|---|---|---|---|---|---|
| DDR3 | 57 | 1 / 2 / 4 / 8 | 128Mx16 / 128Mx8 / 1Gx4 / 1Gx8 / 256Mx16 / 256Mx8 / 512Mx16 / 512Mx8 / 64Mx16 | DDR3-1066 – DDR3-2133 | 1.35 / 1.5 | VFBGA-96 | Commercial 0 to +95 °C / Industrial −40 to +95 °C |
| DDR4 | 30 | 4 / 8 / 16 / 32 | 1Gx16 / 1Gx8 / 256Mx16 / 2Gx16 / 2Gx8 / 4Gx8 / 512Mx16 | DDR4-2666 – DDR4-3200 | 1.2 | FBGA-78/96 | Commercial 0 to +95 °C / Industrial −40 to +95 °C |
| LPDDR4 / LPDDR4X | 39 | 4 / 8 / 16 / 24 / 32 / 64 / 128 | x16 / x32 / x64 | LPDDR4-1600 – LPDDR4X-4266 | 1.8/1.1/0.6 / 1.8/1.1/1.1 / 1.8/1.2/1.2 | VFBGA-200 | Commercial 0 to +95 °C |
| ADI LTM46xx µModule | 21 | — | — | — | — | — | — |
| ADI LTM80xx µModule | 8 | — | — | — | — | — | — |
K4B1G0846I-BCK0) and we reply with the
matching HGCHIPS part plus a field-by-field comparison.
ADI LTM modules are quoted per original part number; the 29
LTM46xx / LTM80xx part numbers above are mapped to HG equivalents named HG46xx / HG80xx.
Original ADI stock (for example LTM3605) is supplied as the original part, not as a replacement.
DDR3, DDR4, LPDDR4 and LPDDR4X memory devices, plus LTM46xx / LTM80xx µModule power modules, as pin-to-pin compatible replacements for imported part numbers. See the family table above for densities, speed grades, voltages and packages.
The replacement uses the same package and the same ball or pad map, so the existing PCB is not changed. We confirm the comparison spec by spec (density, organization, speed, voltage, package, temperature grade) before quoting.
Samples start from 10 pcs, quotes are answered within 24 hours, and in-stock items dispatch from Shenzhen within 48 hours.