Send your BOM or your target part numbers and we return the closest HGCHIPS equivalent with a field-by-field comparison. Compatibility checks and quotations are answered within 24 business hours, samples start from 10 pcs, and in-stock items dispatch from Shenzhen within 48 hours. Write to sales@hgchips.net or use the form on this page.
All fields marked * are required. We reply with a compatibility check and quotation within 24 business hours. Prefer email? Write to sales@hgchips.net or WhatsApp +852 9298 5590.
sales@hgchips.net — sales / RFQ
Zhongshan HQ landline
+86 760 8992 4799
Mobile & WeChat (24h)
+852 9298 5589
WhatsApp — fastest reply
+852 9298 5590 · chat now
Compatibility check + quotation within 24 business hours. Engineering samples from 10 pcs. Test report ships with every lot.
Zhongshan HQ — Zhongshan Huagong Technology Co., Ltd.
Room 301-319, 3/F, Longde Building, Wuguishan Street,
Zhongshan 528400, Guangdong, China
☎ +86 760 8992 4799 · 📱 +852 9298 5589 · 💬 +852 9298 5590
🗺️ Open in Google Maps
Shenzhen Test Center — Shenzhen, Guangdong, China
Incoming inspection, platform verification and burn-in screening.
Chengdu Office — Chengdu, Sichuan, China
Taiwan — engineering & JEDEC spec support
US Sales Support — North America, local timezone
Business hours — Mon–Sat 09:00–18:30 China time (UTC+8). WhatsApp messages answered outside these hours.
Try the cross-reference tool first — 245 memory and 30 ADI-compatible part pages are searchable right now.
Check Cross Reference →Sample quantities start from 10 pcs so you can validate on your own board first. Production MOQ is confirmed with your quotation, per part number.
Yes. We ship a 10-pc sample pack of the cross-referenced part for engineering validation, with the sample cost credited against your first production order.
Yes. Each lot is 100% inspected against the original datasheet and ships with per-lot inspection and validation records; datasheets and compatibility notes are provided for the part number you request.
Within 24 business hours — and same day for parts that are in stock. Send your part numbers, monthly usage and target price for the fastest answer.
Our Taiwan engineering team compares electrical specifications, ball map / pin-out, timing and package against the original manufacturer's public datasheet, then the part is functionally validated on mainstream platforms at the Shenzhen test center. Always qualify on your own platform.
Zhongshan Huagong Technology Co., Ltd. (HGCHIPS) supplies DRAM and power modules as import-substitution stock, with engineering support from Taiwan and sales support in the US.
| Product line | Densities | Voltage | Package | Speed grades |
|---|---|---|---|---|
| DDR3 SDRAM | 1 / 2 / 4 / 8 Gb | 1.35 V / 1.5 V | VFBGA-96 | DDR3-1066 / 1333 / 1600 / 1866 / 2133 |
| DDR4 SDRAM | 4 / 8 / 16 / 32 Gb | 1.2 V | FBGA-78/96 | DDR4-2666 / 2933 / 3200 |
| LPDDR4 / LPDDR4X | 4 / 8 / 16 / 24 / 32 / 64 / 128 Gb | 1.8 / 1.1 / 0.6 V | VFBGA-200 | LPDDR4-1600 to LPDDR4X-4266 |
| ADI LTM46xx / LTM80xx µModule | — | — | — | Replacement line; electrical data per part number |