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W631GG6KB in stock — HGD31G16C16 domestic drop-in replacement (PIN2PIN, no redesign)

HGD31G16C16 is a pin-to-pin compatible replacement for Winbond W631GG6KB. It matches the original on density (1 Gbit), organization (64Mx16), speed grade (DDR3-1600), voltage (1.5 V) and package (96-ball VFBGA), so no PCB or firmware change is required. Samples start at 10 pcs with lot-level test reports.

Specification comparison

W631GG6KB vs HGD31G16C16 — what has to match

Every field below is compared line by line against the original manufacturer's public datasheet before a part is offered as a replacement.

ParameterWinbond W631GG6KB (original)HGD31G16C16 (HGCHIPS)Match
Density (Gbit)11✔ Same
Organization64Mx1664Mx16✔ Same
Speed GradeDDR3-1600DDR3-1600✔ Same
Voltage (V)1.51.5✔ Same
Package96-ball VFBGAVFBGA-96✔ Same
Temperature GradeCommercial (0~+95C)Commercial (0~+95C)✔ Same

Compatibility is based on electrical and mechanical comparison against the original manufacturer's public datasheet. Always qualify on your platform before volume use; test reports and application support are provided. W631GG6KB is a 1.5 V standard DDR3 part; the -12 grade (DDR3-1600) maps directly to HGD31G16C16. For DDR3-1866/2133 speed grades, confirm the matching HG speed bin with our team.

Why switch

Reasons teams open a second source on W631GG6KB

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Supply certainty

When the original is on allocation or past end-of-life, HG parts ship from physical stock — stock lines in 48 hours from Shenzhen.

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Tested, not claimed

Every lot ships with traceable validation records for your incoming QA.

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Engineering support

Datasheet-level comparison and application support from our Taiwan and Shenzhen engineering team.

FAQ

W631GG6KB alternative — common questions

Is HGD31G16C16 a direct replacement for Winbond W631GG6KB?

Yes. HGD31G16C16 is engineered as a pin-to-pin compatible replacement for Winbond W631GG6KB. Ball map, electrical specification and timing are compared against the original manufacturer's public datasheet, and the part is functionally validated before shipment.

Do I need to change my PCB or firmware for HGD31G16C16?

No PCB or firmware change is intended. The part is designed for the same footprint and ball map as Winbond W631GG6KB. Always qualify the replacement on your own board before volume use — we provide samples from 10 pcs and lot-level test reports for that purpose.

What is the minimum order quantity?

Samples start at 10 pcs. Sample cost is credited against your first production order.

What lead time should I expect?

Stock lines ship within 48 hours from Shenzhen. Non-stock and long-lifecycle programs are quoted with a confirmed lead time — send your target quantity and we reply within 24 business hours.

How is compatibility verified?

Our Taiwan engineering team compares density, organization, speed grade, voltage, package and temperature grade against the original datasheet, then the part is functionally validated on mainstream platforms, with traceable per-lot records.

Request HGD31G16C16 samples or a quote

Send your target quantity and platform — we confirm compatibility, share test reports and quote within 24 business hours.

Request a Quote Full HGD31G16C16 specification →
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