K4RAH086VB-BCQK Compatible 16Gb DDR5 Component — HG5000

Name: HG5000 — DDR5 Component compatible replacement
Brand: HGCHIPS
SKU: HG5000

HG5000 is a DDR5 16Gb 2G×8 component compatible with K4RAH086VB-BCQK (Samsung B-die). 82-ball FBGA, 5600 MT/s, 1.1V. Pin-to-pin, no PCB redesign. 量产.

Specifications

HG5000 — key parameters

Density	16Gb
Organization	2G×8
Speed	DDR5-5600 (5600 MT/s)
Voltage	1.1V
Package	82-ball FBGA
Temperature	0°C to +85°C (case)

Second source

Why teams qualify HG5000

Server-grade DDR5 — validated on Intel Xeon 6 (Granite Rapids) and AMD EPYC 9005 (Turin) platforms
Pin-to-pin compatible — footprint, ball map and register config compared against original datasheet
Domestic supply chain — DRAM dies from tier-1 Chinese fabs, assembly & test at tier-1 OSAT partners
Traceable per-lot data — every shipment carries inspection and validation records your QA can sign off
Sample validation — engineering samples available for qualification testing

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