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Samsung C-die / CXMT G4 Compatible 16Gb DDR5 Component — HG5004

HG5004 is a DDR5 16Gb 2G×8 component compatible with Samsung C-die / CXMT G4. 82-ball FBGA, 6400 MT/s, 1.1V. Pin-to-pin, no PCB redesign. 量产.

Specifications

HG5004 — key parameters

Density16Gb
Organization2G×8
SpeedDDR5-6400 (6400 MT/s)
Voltage1.1V
Package82-ball FBGA
Temperature0°C to +85°C (case)
Second source

Why teams qualify HG5004

  • Server-grade DDR5 — validated on Intel Xeon 6 (Granite Rapids) and AMD EPYC 9005 (Turin) platforms
  • Pin-to-pin compatible — footprint, ball map and register config compared against original datasheet
  • Domestic supply chain — DRAM dies from tier-1 Chinese fabs, assembly & test at tier-1 OSAT partners
  • Traceable per-lot data — every shipment carries inspection and validation records your QA can sign off
  • Sample validation — engineering samples available for qualification testing

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