Micron 512GB DDR5 RDIMM ā 9,200 MT/s Server Memory Module
Pre-production preview: 512GB single-module DDR5 RDIMM with TSV-stacked 32Gb dies ā demonstrated 2026-09-15, volume production expected 2H 2027
Last updated: 2026-11-11On September 15, 2026, Micron demonstrated the industry's first 512GB DDR5 RDIMM, a single-module answer to AI-driven memory-density demand: one 512GB module replaces four 128GB RDIMMs while cutting module power by about 63%. This is a pre-production watch page ā the module is not yet orderable and no public part number exists. Below are the confirmed specifications and the signals we track for buyers planning around this part.
Quick Overview
Specifications
Source: Micron official press release, 2026-09-15 (investors.micron.com). Checked 2026-11-11. Fields not stated in the release are marked "not stated".
| Manufacturer | Micron |
|---|---|
| Official announcement | Micron press release, 2026-09-15 |
| Module type | DDR5 RDIMM server memory module (registered, ECC) |
| Capacity | 512 GB per module |
| Data rate | Up to 9,200 MT/s |
| Voltage | 1.1 V |
| Module power | 16.0 W per module ā about 63% lower than a 4Ć128GB RDIMM set (44.2 W) |
| DRAM technology | 32Gb DDR5 DRAM dies with TSV-based 3D stacking (8-layer) |
| Interface | Standard DDR5 RDIMM interface, JEDEC-compliant (per release) |
| Platform validation | In progress with AMD and Intel for next-generation server platforms |
| Production status | Volume production expected in the second half of 2027 |
| Orderable part number | Not yet published (as of 2026-11-11) |
Live Price & Stock Signals
Third-party public signals for reference only ā not HGCHIPS quotations. This module is pre-production; there is no authorized stock anywhere yet.
| Source | Signal | Date |
|---|---|---|
| Micron investor relations (investors.micron.com) | Official specs disclosed; volume production window 2H 2027; AMD/Intel validation underway | release 2026-09-15; checked 2026-11-11 |
| Authorized distribution (DigiKey / Mouser checks) | No listings found ā module is pre-production, no orderable OPN published | checked 2026-11-11 |
| Market context | High-capacity DDR5 RDIMM supply industry-wide remains tight amid AI-server demand; 512GB modules are expected to be allocation-constrained at launch | checked 2026-11-11 |
Plan ahead for the 512GB DDR5 RDIMM generation
The module cannot be ordered yet ā but your BOM and platform plans can be. Send us your memory roadmap; we will quote currently-orderable high-capacity RDIMM alternatives and notify you when this 512GB class becomes available.
š§ info@hgtech.ccSpecifications on this page are taken from the Micron press release dated 2026-09-15 (investors.micron.com), last checked 2026-11-11. Pre-production information is subject to change without notice. Micron is a trademark of Micron Technology, Inc. HGCHIPS is not affiliated with or endorsed by Micron; the original-brand part referenced is an original-brand part. Price/stock signals are public third-party listings collected for buyer reference and do not constitute offers by HGCHIPS.