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Micron 512GB DDR5-4800 ECC RDIMM MTC40F2046S1RC48 — Stock & Roadmap | HGCHIPS

Micron MTC40F2046S1RC48 is the 512GB DDR5-4800 ECC RDIMM built with Micron's die-stacked (TSV) DRAM — the family Micron demonstrated at 9,200 MT/s on September 15–16, 2026, delivering 12TB per 24 DIMM slots at only 16.0W per module. This is the highest-capacity server RDIMM line shipping ahead of volume TSV production in H2 2027, and demand from AI server builders is far ahead of supply. HGCHIPS sources this family through channel stock with full traceability: send your BOM line and we confirm exact suffix availability, test records and lead time within 24 hours.

Specifications

MTC40F2046S1RC48 — key parameters

ManufacturerMicron
Part number familyMTC40F2046S1RC48 (512GB DDR5-4800 class; related MTC40F2046 speed variants 4800/5600/6400)
Memory technologyDDR5 SDRAM, die-stacked (TSV)
Capacity512GB
Data rate4800 MT/s production class (family demonstrated at 9,200 MT/s, Sep 2026)
CAS latencyCL40 family (CL40/46/52 across speed grades)
Module typeRDIMM (Registered ECC)
Form factor288-pin RDIMM
Voltage1.1V
Power (demo module)16.0W vs 44.2W for two 256GB modules — 64% energy saving per 512GB
Bandwidth (demo)9,200 MT/s → 12TB per 24 DIMM slots (vs 6TB today)
AvailabilityChannel stock on request; volume TSV production H2 2027
Error correctionOn-die ECC + module ECC

Electrical parameters from Micron MTC40F2046 family datasheet (Mouser) and Sep 2026 launch coverage. Market signals retrieved 2026-11-11; dates shown per row.

Why buy from HGCHIPS

Stock, testing, traceability

  • Real channel stock — not a broker chain; we hold or directly control the trays we quote
  • Tested before shipment — SPD verification plus functional run on a DDR5 platform, traceable per lot
  • Exact suffix match — we ship the precise part number on your BOM, photos and date codes with the quote
  • 24-hour quotes — BOM line in, firm price and lead time back the same business day
  • Flexible Incoterms — EXW Zhongshan, Hong Kong handover or DDP on request
Market signal

Why this part is hot right now

SignalDetailSource & date
Technology demonstrationMicron demonstrated the 512GB TSV-based RDIMM at 9,200 MT/s at a Sept 15–16, 2026 launch event, reporting AMD and Intel validation under way and volume production in H2 2027.Tom's Hardware / Blocks & Files / heise online coverage, Sep 2026
AI-server demand pullTrade press frames 512GB RDIMMs as the memory ceiling-raiser for AI servers and 2-socket Xeon/EPYC builds through 2027 — the exact segment HGCHIPS supplies.Omnixon / Blocks & Files / Tom's Hardware, Sep–Oct 2026
Family availabilityMTC40F2046 family datasheets and listings circulate through Mouser and channel distributors — the 512GB production class is orderable today, speed-bin suffixes confirmed at quotation.Mouser MTC40F2046WS1RC datasheet; omnixon.com listing, retrieved 2026-11-11
FAQ

MTC40F2046S1RC48 — frequently asked questions

Is the 9,200 MT/s speed available to buy today?

No — 9,200 MT/s was the September 2026 demonstration speed. Production 512GB modules ship in the 4800–6400 MT/s speed classes today; volume TSV production is slated for H2 2027. We quote the currently orderable suffix and note the roadmap in the offer.

What is the real difference of TSV (die-stacked) DDR5?

Through-silicon-via stacking puts multiple DRAM dies in one package, so a 512GB module uses far fewer packages, runs at 16W instead of ~44W per 512GB, and frees DIMM slots — 12TB in 24 slots instead of 6TB. That is why AI server builders are pre-booking this family.

Can you supply the exact suffix my BOM requires?

Send the complete part number including the suffix (e.g. ...RC48B##). We match the suffix, provide photos of the actual modules and date codes, and attach the functional test record before you commit.

Get price and availability for MTC40F2046S1RC48

Send your BOM line, target quantity and delivery terms — we reply within 24 business hours.

Request a Quote info@hgtech.cc
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