HGCHIPS 256GB DDR5-6400 ECC RDIMM (HGD5R series) is the pin-to-pin compatible replacement for Samsung M321RBJA0M22-CLP — the 4Rx4, CL40, PC5-51200 flagship module built from 3DS-stacked 16G dies ((2H 3DS 16G × 4) × 40, 32Gx72 organization), listed by Samsung's module decoder at mass-production status. The 256GB tier is the top of the DDR5 RDIMM roadmap — four times the density of a 64GB module in the same 288-pin slot — and it trades accordingly: CoreWave lists M321RBJA0M22-CLP at US$9,565/pc with 50 pcs and 3–4 day lead, while secondary-market buyers post US$3,024 acquisition offers for the same code, the widest bid/ask spread in the server DRAM book. The HGCHIPS replacement ships from Shenzhen stock at ¥61,800/pc tax included (≈ US$8,670) — about 10% below the lowest dated broker reference — within 48 hours, every lot functionally tested on a DDR5 platform with traceable records. Small-batch board validation before full import is recommended; samples ship immediately.
| Reference part number | Samsung M321RBJA0M22-CLP (256GB 4Rx4 DDR5-6400, CL40) |
|---|---|
| HGCHIPS series | HGD5R — DDR5 RDIMM replacement series (full P/N via FAE) |
| Memory technology | DDR5 SDRAM, 3DS-stacked dies |
| Capacity | 256GB |
| Data rate | 6400 MT/s (PC5-51200) |
| CAS latency | CL40 |
| Module type | RDIMM (Registered ECC) |
| Rank / organization | 4Rx4 — 32Gx72 organization |
| Component composition | (2H 3DS 16G × 4) × 40 |
| Voltage | 1.1V |
| Form factor | 288-pin RDIMM |
| Error correction | On-die ECC + module ECC |
| Product status | Mass production (per Samsung module part-number decoder) |
| Module class | Top-capacity DDR5 RDIMM tier — 4× the density of 64GB in one slot |
Electrical parameters referenced from Samsung's module part-number decoder (distributor mirror, checked 2026-11-14) and distributor spec sheets (compuram.biz / serverorbit.com / maychuvina.com); HGCHIPS replacement parameters verified to match the reference profile. Market signals retrieved 2026-11-14; dates shown per row.
| Signal | Detail | Source & date |
|---|---|---|
| Broker spot lots | CoreWave lists M321RBJA0M22-CLP at US$9,565/pc with 50 pcs, 3–4 day lead (listing family updated 2026); German value-add distributor CTT also stocks the module — the newest, highest-capacity DDR5 RDIMM point is available only in thin, expensive lots. | corewavelabs.com listing / ctt.de product page, 2026 (retrieved 2026-11-14) |
| Secondary-market demand | RebootSemi's published acquisition (buyback) price list posts US$3,024 for the 256GB DDR5-6400 3DS code — evidence of strong two-way flow in the 256GB tier as AI-memory upsizing pulls every large module off the shelf. | rebootsemi.com buyback list, 2026-10-31 (retrieved 2026-11-14) |
| Mass-production status | Samsung's module part-number decoder lists M321RBJA0M22-CLP at 256GB / 6400 Mbps / 1.1V / mass production / 4Rx4 — a shipping JEDEC product, not a roadmap slide. | Samsung module PN decoder (distributor mirror), checked 2026-11-14 |
| HGCHIPS price position | ¥61,800/pc tax incl. (≈ US$8,670) vs. broker reference US$9,565 (CoreWave, Oct 2026) — about 10% below; 48h Shenzhen shipment; lot test records provided. | HGCHIPS price list, Nov 2026 |
Yes — same 288-pin RDIMM form factor, 4Rx4 organization and CL40 speed profile; current Intel Xeon and AMD EPYC platforms identify it without board or firmware changes. We recommend a small-batch board validation (samples available) before full production import, as with any 3DS high-capacity module.
The 256GB 3DS tier is supported on the newest Xeon 6 / EPYC 9005-class platforms per CPU population rules; it also down-clocks to 5600/5200/4800 MT/s where the platform caps memory speed. Send your server model and we confirm population rules before quoting.
3DS stacking, 40-die assembly and the thickest SPD qualification in the DRAM book make 256GB the scarcest DDR5 RDIMM point; the US$9,565 broker reference vs US$3,024 secondary bid shows how thin the tape is. Volume commitments move the price materially — send your BOM line for a firm quote.
Send your BOM line, target quantity and delivery terms — engineering review and firm price back within 24 business hours.
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